



Introduction
The Yokogawa F3SP71-4S Sequence CPU Module is a high-speed, network-enabled core controller designed for FA-M3 PLC systems. It is engineered for advanced industrial automation environments that require fast logic execution, integrated communication, and efficient large-scale control handling within a compact CPU architecture.
As part of Yokogawa’s high-performance FA-M3 CPU family, this module combines ultra-fast instruction processing with built-in Ethernet networking and modern memory management features, making it suitable for both machine-level control and distributed industrial systems.
Technical Specifications
| Parameter | Specification |
|---|
| Model | F3SP71-4S |
| Module Type | Sequence CPU Module |
| Series | FA-M3 |
| Control Method | Stored program, cyclic scan execution |
| Processor Speed | High-speed 32-bit CPU architecture |
| Basic Instruction Speed | ~0.00375 μs per instruction |
| Program Capacity | Approx. 60K steps |
| I/O Capacity | Large-scale FA-M3 system compatible |
| Instruction Set | Basic + extended application instructions |
| Communication | Built-in Ethernet (10/100BASE-TX) |
| Protocol Support | TCP/IP, Modbus TCP (slave), network services |
| Storage | SD memory card slot supported |
| Memory Type | RAM + non-volatile storage support |
| Diagnostic Functions | CPU, memory, and I/O self-diagnostics |
| Sensor Control Mode | Independent high-speed scan processing |
| Power Consumption | Approx. 460 mA @ 5 V DC |
| Mounting | FA-M3 base unit slot |
| Operating Temperature | 0°C to 55°C |
| Storage Temperature | -20°C to 75°C |
| Humidity | 10–90% RH (non-condensing) |
| Dimensions (W × H × D) | 28.9 × 100 × 83.2 mm |
| Weight | Approx. 0.12–0.20 kg |
Applications
The F3SP71-4S is widely used in high-speed automation systems where both real-time logic execution and network connectivity are essential. Typical applications include:
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High-speed packaging and labeling machines
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Semiconductor production equipment
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Factory automation and assembly lines
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Machine synchronization and motion coordination systems
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Process control systems requiring fast response cycles
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Smart manufacturing and connected industrial systems
Its built-in networking capability makes it especially effective in distributed control environments.
Advantages
One of the key advantages of the F3SP71-4S is its extremely fast instruction execution speed (as low as 0.00375 μs), enabling ultra-responsive control performance for time-critical automation tasks.
It features built-in Ethernet communication, allowing direct integration with SCADA systems, engineering stations, and higher-level industrial networks without additional modules.
The module supports Modbus TCP slave functionality, making it easy to integrate into multi-vendor automation architectures and industrial IoT environments.
Its SD memory card support enables flexible program storage, backup, and large data handling, improving engineering efficiency and system scalability.
Additionally, its sensor control mode allows independent high-speed processing, improving responsiveness in fast-changing industrial processes.
Technical FAQs
1. What is the main function of the F3SP71-4S?
It acts as a high-speed sequence CPU controlling FA-M3 PLC systems with integrated networking features.
2. What is its instruction speed?
Approximately 0.00375 μs per basic instruction, making it extremely fast.
3. How large is its program capacity?
Around 60,000 steps.
4. Does it support Ethernet communication?
Yes, it includes built-in 10/100BASE-TX Ethernet.
5. What communication protocols are supported?
TCP/IP, Modbus TCP (slave), and network services.
6. Does it support SD card storage?
Yes, it supports SD memory card expansion for data and program storage.
7. Is it suitable for large systems?
Yes, it is designed for medium to large-scale FA-M3 automation systems.
8. What programming tools are used?
Yokogawa WideField3 programming software.
9. Can it handle real-time control tasks?
Yes, it is optimized for deterministic high-speed control.
10. What industries commonly use it?
Manufacturing, electronics, semiconductor, and automated production systems.