Introduction
The Schneider TSXFPACC3 Fipio Insulated Bus Connection Box is an essential communication accessory within the Modicon TSX Micro automation platform. This compact insulated connection box provides a dedicated interface point for Fipio bus cabling — enabling reliable electrical isolation and consistent signal integrity between distributed I/O modules and communication components in industrial PLC systems.
Engineered for systems where organized bus topology and clear electrical separation are required, the TSXFPACC3 simplifies installation, reduces potential interference, and enhances the robustness of fieldbus connections in automated machinery and control networks.
Technical Specifications
| Specification | Details |
|---|
| Model | TSXFPACC3 |
| Manufacturer | Schneider Electric |
| Module Type | Fipio insulated bus connection box |
| Platform Compatibility | Modicon TSX Micro |
| Bus Connector | 1 × SUB‑D 9‑pin connector |
| Material | Polycarbonate enclosure |
| Voltage Rating | 24 V DC bus connection |
| Protection Class | IP20 enclosure |
| Operating Temperature | 0°C to 60°C |
| Storage Temperature | ‑25°C to 70°C |
| Humidity | 5–80% RH, non‑condensing |
| Weight | Approx. 0.09 kg (0.20 lb) |
| Mounting Method | Panel or rack entry point |
Applications
Fipio Bus Integration
Acts as a central connection point for Fipio bus cabling, enabling multiple modules and network segments to interface reliably.
Distributed I/O Architectures
Used in automation systems where I/O modules are distributed across machines or control panels but must remain electrically tied to a single bus infrastructure.
Control Cabinet Organization
Helps maintain neat and logical wiring layouts by providing a dedicated insulated point for bus termination and connection.
Signal Isolation
Electrical insulation reduces the risk of interference or unintended signal coupling between modules and helps maintain robust communication performance.
Modular Expansion Projects
Ideal for systems where additional Fipio modules or accessories are added over time, helping simplify low‑voltage bus integration.
Advantages
Reliable Bus Interfacing
The insulated connection box ensures consistent electrical connectivity while minimizing noise and interference on the Fipio bus.
Compact and Lightweight
Its small form factor makes it easy to install in tight control cabinet environments without adding significant physical bulk.
Standard SUB‑D 9 Connector
The widely used SUB‑D 9 interface enables straightforward connection with cables and communication modules, reducing installation time.
Durable Construction
Polycarbonate enclosure offers dependable protection suitable for typical industrial electrical environments.
Flexible Mounting
Its simple footprint and IP20 rating allow for integration into various cabinet or panel layouts without complexity.
Technical FAQs
1. What is the TSXFPACC3 used for?
It’s a Fipio insulated bus connection box used to connect and electrically isolate segments of the Fipio bus in Modicon TSX Micro systems.
2. How many connectors does it have?
The module includes one SUB‑D 9‑pin connector for bus connection.
3. What type of bus network is supported?
Designed for Fipio bus topologies within the Modicon TSX Micro PLC ecosystem.
4. What is the enclosure protection rating?
The connection box is rated IP20, suitable for protected control cabinet environments.
5. What is the operating voltage?
It interfaces with 24 V DC bus wiring typical of TSX Micro I/O distribution.
6. What temperature range can it operate in?
TSXFPACC3 functions reliably between 0°C and 60°C.
7. Does it include internal isolation?
Yes — the unit provides electrical isolation to maintain signal integrity on the bus.
8. What mounting options are possible?
It can be mounted at a panel entry point or within an I/O cabinet near other PLC modules.
9. Is the enclosure material industrial grade?
Yes — the durable polycarbonate construction resists typical control cabinet conditions.
10. Can it be used with expanded cable systems?
Yes — it supports modular Fipio bus architectures and facilitates structured bus wiring layouts.
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